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Product Name:Batch-type Electroplating
Model: KS-B-Plating-001
Route Application: Electroplating for HJT, TOPCon, and XBC solar cells
Function: Compatible with single-side and double-side electroplating for various cell types; supports nickel, copper, and tin plating according to process requirements
Process Flow: Degreasing, rinsing, activation, copper plating, rinsing, activation, tin plating, rinsing, slow lifting, drying
Compatible Wafer: Compatible with various wafer sizes such as 210×105 mm, 182×182 mm, 210×182 mm, etc.
Cassette Number: 4, 6 cassettes
Capacity: "Single-side plating: 20,000+ half-cells/hour
Double-side plating: 14,400+ half-cells/hour"
Breakage Rate: Wafer thickness ≥130 μm, breakage rate <0.01%
Power Consumption/ Voltage: 305 kW, 380 V
Features: High throughput per unit area, excellent uniformity, high process stability, and strong compatibility

Product Name:Batch-type Electroplating
Model: KS-B-Plating-001
Route Application: Electroplating for HJT, TOPCon, and XBC solar cells
Function: Compatible with single-side and double-side electroplating for various cell types; supports nickel, copper, and tin plating according to process requirements
Process Flow: Degreasing, rinsing, activation, copper plating, rinsing, activation, tin plating, rinsing, slow lifting, drying
Compatible Wafer: Compatible with various wafer sizes such as 210×105 mm, 182×182 mm, 210×182 mm, etc.
Cassette Number: 4, 6 cassettes
Capacity: "Single-side plating: 20,000+ half-cells/hour
Double-side plating: 14,400+ half-cells/hour"
Breakage Rate: Wafer thickness ≥130 μm, breakage rate <0.01%
Power Consumption/ Voltage: 305 kW, 380 V
Features: High throughput per unit area, excellent uniformity, high process stability, and strong compatibility